Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1305E+
|
Maxim Integrated | 功能相似 | TSSOP-20 |
MAXIM INTEGRATED PRODUCTS DS1305E+ 芯片, 实时时钟 3线接口/SPI
|
||
DS1305EN+
|
Maxim Integrated | 完全替代 | TSSOP-20 |
MAXIM INTEGRATED PRODUCTS DS1305EN+ 芯片, 实时时钟, 串行, 警报, BCD, SMD, 1305
|
||
DS1305EN+
|
Dallas Semiconductor | 完全替代 | TSSOP |
MAXIM INTEGRATED PRODUCTS DS1305EN+ 芯片, 实时时钟, 串行, 警报, BCD, SMD, 1305
|
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