Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1265Y-70
|
Maxim Integrated | 类似代替 | EDIP-36 |
IC NVSRAM 8Mbit 70NS 36DIP
|
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