Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1249Y-70#
|
Dallas Semiconductor | 功能相似 |
IC NVSRAM 2Mbit 70NS 32DIP
|
|||
|
|
Maxim Integrated | 功能相似 | EDIP-32 |
IC NVSRAM 2Mbit 70NS 32DIP
|
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