Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Dallas Semiconductor | 类似代替 | DIP |
MAXIM INTEGRATED PRODUCTS DS1245AB-100+ 芯片, 存储器, NVRAM
|
||
|
|
Maxim Integrated | 完全替代 | DIP-32 |
1024K非易失SRAM 1024k Nonvolatile SRAM
|
||
DS1245Y-70+
|
Dallas Semiconductor | 类似代替 | DIP |
MAXIM INTEGRATED PRODUCTS DS1245Y-70+ 芯片, 存储器, NVSRAM, 1024KB, 128KX8, 32EDIP
|
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