Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1023S-100+
|
Dallas Semiconductor | 功能相似 | SOIC |
MAXIM INTEGRATED PRODUCTS DS1023S-100+ 芯片, 延迟线
|
||
DS1023S-50+
|
Maxim Integrated | 功能相似 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS DS1023S-50+ 芯片, 延迟线
|
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