Chip AI consultant
Technical parameters/power supply voltage (DC): 3.30 V, 5.00 V
Technical parameters/rise/fall time: 1 ns
Technical parameters/power supply current: 10.0 mA
Technical parameters/number of channels: 1
Technical parameters/dissipated power: 195 mW
Technical parameters/data rate: 150 Mbps
Technical parameters/isolation voltage: 2500 Vrms
Technical parameters/Over temperature protection: No
Technical parameters/descent time (Max): 2 ns
Technical parameters/rise time (Max): 2 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 195 mW
Technical parameters/power supply voltage: 3V ~ 5.5V
Technical parameters/power supply voltage (Max): 5.5 V
Technical parameters/power supply voltage (Min): 3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ISO722MD
|
TI | 完全替代 | SOIC-8 |
3.3 V / 5 V高速数字隔离器 3.3-V / 5-V HIGH-SPEED DIGITAL ISOLATORS
|
||
ISO722MDRG4
|
TI | 完全替代 | SOIC-8 |
3.3 V / 5 V高速数字隔离器 3.3-V / 5-V HIGH-SPEED DIGITAL ISOLATORS
|
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