Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN7406D
|
TI | 功能相似 | SOIC-14 |
74xx 系列,Texas Instruments 标准 TTL 逻辑 工作电压 4.75 至 5.25 ### 74xx 系列
|
||
SN7406D
|
National Semiconductor | 功能相似 | SOIC |
74xx 系列,Texas Instruments 标准 TTL 逻辑 工作电压 4.75 至 5.25 ### 74xx 系列
|
||
SN7406DRE4
|
TI | 功能相似 | SOIC-14 |
六反相缓冲器/带集电极开路高压输出驱动程序 HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS
|
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