Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG509ACJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG509ACJ+ 芯片, 模拟多路复用器, 双路, 4:1, DIP-16
|
||
MAX338ESE+
|
Maxim Integrated | 类似代替 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS MAX338ESE+.. 芯片, 多路复用器/分离器, 8X1, 400Ω, 16NSOIC
|
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