Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG390AK
|
Maxim Integrated | 功能相似 | DIP |
通用CMOS模拟开关 General Purpose CMOS Analog Switches
|
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