Technical parameters/contact type: SPST
Technical parameters/digits: 4
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape, Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX358EWE+
|
Maxim Integrated | 完全替代 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS MAX358EWE+ 芯片, 模拟多路复用器, 单路, 8:1, WSOIC-16
|
||
MAX399CPE+
|
Maxim Integrated | 完全替代 | DIP-16 |
MAXIM INTEGRATED PRODUCTS MAX399CPE+ 芯片, 模拟多路复用器, 双路, 4:1, DIP-16
|
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