Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TIBPAL16R6-25CN
|
TI | 功能相似 | DIP-20 |
低功耗高性能影响é PAL电路 LOW-POWER HIGH-PERFORMANCE IMPACT E PAL CIRCUITS
|
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