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Model CY7C1518AV18-250BZC
Description 722-Word Burst Architecture for Megabit DDR-II SRAM with 72 Mbit DDR-II SRAM
Product QR code
Brand: Cypress Semiconductor
Packaging FBGA-165
Delivery time
Packaging method
Standard packaging quantity 1
213.77  yuan 213.77yuan
1+:
$ 245.8309
10+:
$ 239.4179
50+:
$ 234.5013
100+:
$ 232.7912
200+:
$ 231.5086
500+:
$ 229.7985
1000+:
$ 228.7296
2000+:
$ 227.6608
Quantity
1+
10+
50+
100+
200+
Price
$245.8309
$239.4179
$234.5013
$232.7912
$231.5086
Price $ 245.8309 $ 239.4179 $ 234.5013 $ 232.7912 $ 231.5086
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3207) Minimum order quantity(1)
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Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/height: 0.89 mm

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
GS8662T18BD-250 GS8662T18BD-250 GSI 功能相似 FBGA
SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165Pin FBGA Tray

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