Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: WDIP
External dimensions/packaging: WDIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 功能相似 | WDIP |
UVPROM, 32KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
|
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