Technical parameters/dissipated power: 14 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 38
Encapsulation parameters/Encapsulation: TSSOP-38
External dimensions/packaging: TSSOP-38
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IP4777CZ38
|
Nexperia | 功能相似 |
Consumer Circuit
|
|||
IP4777CZ38,118
|
NXP | 功能相似 | TFSOP-38 |
ESD 抑制器/TVS 二极管 DVI/HDMI INTRF W/ESD DDC BUFF SLEW RT ACC
|
||
IP4777CZ38,118
|
Nexperia | 功能相似 | TSSOP-38 |
ESD 抑制器/TVS 二极管 DVI/HDMI INTRF W/ESD DDC BUFF SLEW RT ACC
|
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