Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MELF
External dimensions/packaging: MELF
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZV55C4V7
|
Vishay Semiconductor | 功能相似 | MELF |
单管二极管 齐纳, 4.7 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review