Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZV55-C3V9,115
|
Nexperia | 功能相似 | SOD-80 |
BZV55 系列 3.9 V ±5 % 500 mW 表面贴装 稳压二极管 - SOD-80C
|
||
BZV55-C3V9,115
|
NXP | 功能相似 | SOD-80 |
BZV55 系列 3.9 V ±5 % 500 mW 表面贴装 稳压二极管 - SOD-80C
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review