Technical parameters/dissipated power: 145 mW
Technical parameters/forward voltage (Max): 1.8 V
Technical parameters/forward current (Max): 25 mA
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 145 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP-8
External dimensions/length: 9.91 mm
External dimensions/width: 7.57 mm
External dimensions/height: 2.92 mm
External dimensions/packaging: DIP-8
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-530K
|
AVAGO Technologies | 完全替代 | DIP-8 |
逻辑输出光电耦合器 450ns PWD 30%CTR Hermetically sealed
|
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