Technical parameters/number of channels: 4
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: VSSOP
External dimensions/packaging: VSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BUF04701AIDGSR
|
TI | 完全替代 | VSSOP-10 |
4通道,轨至轨CMOS缓冲放大器 4-Channel, Rail-to-Rail, CMOS BUFFER AMPLIFIER
|
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