Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD
External dimensions/diameter: 20.0 mm
External dimensions/packaging: SMD
Physical parameters/operating temperature: -40℃ ~ 280℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review