Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: DPAK
External dimensions/packaging: DPAK
Other/Product Lifecycle: Active
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCR8DCMT4G
|
Littelfuse | 功能相似 | TO-252-3 |
ON SEMICONDUCTOR MCR8DCMT4G 晶闸管, SCR, 8A
|
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