Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Not recommended for use in new designs
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BQ4847Y-MT
|
TI | 功能相似 | DIP |
RTC模块, CPU监控电路 RTC Module With CPU Supervisor
|
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