Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BGA2714,115
|
NXP | 功能相似 | SOT-363-6 |
RF Amp Chip Single GP 4V 6Pin TSSOP T/R
|
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