Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: SC-70
External dimensions/packaging: SC-70
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BFR92ARGELB-GS08
|
VISHAY | 类似代替 | SOT-23 |
硅NPN平面RF晶体管 Silicon NPN Planar RF Transistor
|
||
BFR92ARGELB-GS08
|
Vishay Semiconductor | 类似代替 | SOT-23 |
硅NPN平面RF晶体管 Silicon NPN Planar RF Transistor
|
||
|
|
Philips | 类似代替 | SC-70 |
Trans RF BJT NPN 12V 0.035A 300mW 3Pin SC-70 T/R
|
||
|
|
Samsung | 类似代替 |
VHF / UHF晶体管NPN硅 VHF/UHF Transistors NPN Silicon
|
|||
MPSH10
|
UTC | 类似代替 | TO-92 |
VHF / UHF晶体管NPN硅 VHF/UHF Transistors NPN Silicon
|
||
MPSH10
|
ON Semiconductor | 类似代替 | TO-226-3 |
VHF / UHF晶体管NPN硅 VHF/UHF Transistors NPN Silicon
|
||
MPSH10
|
CJ | 类似代替 | TO-92 |
VHF / UHF晶体管NPN硅 VHF/UHF Transistors NPN Silicon
|
||
|
|
NXP | 类似代替 | TO-92 |
VHF / UHF晶体管NPN硅 VHF/UHF Transistors NPN Silicon
|
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