Chip AI consultant
Package parameters/number of pins: 70
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/ECCN (US): 3A991
Other/Part Status: Obsolete
Other/Automotive: No
Other/Pin Count: 70
Other/Supplier Package: BGA
Other/Counting: Surface Mount
Other/Package Height: 0.6
Other/Package Length: 5.5
Other/Package Width: 5.5
Other/PCB changed: 70
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