Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY74FCT823ATPC
|
TI | 功能相似 | DIP-24 |
8 / 9- / 10位总线接口寄存器 8-/9-/10-Bit Bus Interface Registers
|
||
CY74FCT823BTPC
|
TI | 完全替代 | PDIP-24 |
8 / 9- / 10位总线接口寄存器 8-/9-/10-Bit Bus Interface Registers
|
||
CY74FCT823BTPC
|
Cypress Semiconductor | 完全替代 | DIP |
8 / 9- / 10位总线接口寄存器 8-/9-/10-Bit Bus Interface Registers
|
||
CY74FCT823BTPCE4
|
TI | 功能相似 | DIP-24 |
9Bit Bus Interface Flip-Flops with 3-State Outputs 24-PDIP -40℃ to 85℃
|
||
IDT54FCT823BDB
|
E2V | 功能相似 |
HIGH-PERFORMANCE CMOS BUS INTERFACE REGISTERS
|
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