Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Artesyn Embedded Technologies | 完全替代 | DIP-8 |
Module DC-DC 48Vin 2Out 12V/-12V 0.83A 20W 7Pin
|
||
|
|
Emerson | 完全替代 |
Module DC-DC 48Vin 2Out 12V/-12V 0.83A 20W 7Pin
|
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