Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CTX100-4
|
Cooper Bussmann | 功能相似 | Nonstandard |
Inductor Power Wirewound 99.23uH/396.9uH 20% 100kHz Amorphous Metal 920mA/460mA 0.302Ω/1.21Ω DCR T/R
|
||
CTX100-4
|
Eaton Bussmann | 功能相似 | Nonstandard |
Inductor Power Wirewound 99.23uH/396.9uH 20% 100kHz Amorphous Metal 920mA/460mA 0.302Ω/1.21Ω DCR T/R
|
||
|
|
Eaton Bussmann | 功能相似 |
100.57uH ±25% 1.37A
|
|||
CTX100-4P-R
|
Cooper Bussmann | 功能相似 | SMD |
Inductor Power Wirewound 99.09uH/396.38uH 20% 100kHz Powdered Iron 720mA/360mA 0.565Ω/2.259Ω DCR T/R
|
||
CTX100-4P-R
|
Coiltronics/Cooper Bussmann | 功能相似 | SMD |
Inductor Power Wirewound 99.09uH/396.38uH 20% 100kHz Powdered Iron 720mA/360mA 0.565Ω/2.259Ω DCR T/R
|
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