Technical parameters/number of contacts: 8
Technical parameters/rated voltage (DC): 100 V
Technical parameters/tolerances: ±2 %
Technical parameters/resistance: 330 Ω
Technical parameters/resistance deviation: ±2 %
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SIP-8
External dimensions/length: 20.1 mm
External dimensions/width: 2.49 mm
External dimensions/height: 4.95 mm
External dimensions/packaging: SIP-8
External dimensions/thickness: 2.49 mm
Physical parameters/operating temperature: -55℃ ~ 125℃
Physical parameters/temperature coefficient: ±100 ppm/℃
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
4608X-AP1-331
|
Bourns J.W. Miller | 功能相似 | N/R |
Res Thick Film NET 330Ω 2% 1W ±100ppm/℃ BUS Conformal 8Pin SIP Pin Thru-Hole Bulk
|
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