Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 900
Encapsulation parameters/Encapsulation: BBGA-900
External dimensions/packaging: BBGA-900
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX150-L1FG900C
|
Xilinx | 完全替代 | BBGA-900 |
FPGA Spartan-6 LX Family 147443 Cells 45nm Technology 1V 900Pin FBGA
|
||
XC6SLX150-L1FGG900C
|
Xilinx | 完全替代 | BBGA-900 |
FPGA Spartan-6 LX Family 147443 Cells 45nm Technology 1V 900Pin FBGA
|
||
XC6SLX150-L1FGG900I
|
Xilinx | 完全替代 | BBGA-900 |
FPGA Spartan®-6 LX Family 147443 Cells 45nm (CMOS) Technology 1V 900Pin F-BGA
|
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