Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 128
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 功能相似 | LQFP-128 |
4K x 18 DualSync FIFO, 3.3V
|
||
72V845L15PF8
|
Integrated Device Technology | 功能相似 | LQFP-128 |
4K x 18 DualSync FIFO, 3.3V
|
||
72V845L15PFI
|
Integrated Device Technology | 功能相似 | TQFP-128 |
FIFO, 4KX18, 10ns, Synchronous, CMOS, PQFP128, TQFP-128
|
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