Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/packaging: TSSOP-14
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC74LVXT4066DR2
|
ON Semiconductor | 功能相似 | SOIC-14 |
四路双向模拟开关
|
||
MC74LVXT4066DR2G
|
ON Semiconductor | 功能相似 | SOIC-14 |
ON SEMICONDUCTOR MC74LVXT4066DR2G 模拟开关, 四通道, SPST, 4 放大器, 40 ohm, 2V 至 5.5V, NSOIC, 14 引脚
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