Technical parameters/power supply voltage: 2.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 352
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 功能相似 | LBGA-352 |
IC FPGA 2.5V C-TEMP 352-MBGA
|
||
|
|
Xilinx | 功能相似 | LBGA-352 |
IC FPGA 2.5V I-TEMP 352-MBGA
|
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