Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BFQFP-208
External dimensions/packaging: BFQFP-208
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT79RC32T355-133DH
|
Integrated Device Technology | 功能相似 | BFQFP-208 |
IDT是Interprise集成通信处理器 IDT Interprise Integrated Communications Processor
|
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