Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-48
External dimensions/packaging: TSSOP-48
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
COP8CBE9IMT9/NOPB
|
TI | 功能相似 | TSSOP-48 |
IC MCU EEPROM 8Bit 8K 48-TSSOP
|
||
COP8CBE9IMT9/NOPB
|
National Semiconductor | 功能相似 | TSSOP-48 |
IC MCU EEPROM 8Bit 8K 48-TSSOP
|
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