Technical parameters/power supply voltage: 3V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-24
External dimensions/packaging: SOIC-24
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
MX-Com | 类似代替 |
Modem Chip Single 200Kbps
|
|||
CMX589AD5
|
CML Innovative Technologies | 类似代替 |
Modem Chip Single 200Kbps
|
|||
CMX589AD5
|
CML Microcircuits | 类似代替 | SSOP-24 |
Modem Chip Single 200Kbps
|
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