Technical parameters/Contact electroplating: Tin
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
3070TR
|
Keystone Electronics | 完全替代 | SMD |
RETAINER COIN CELL 20MM SMD
|
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