Encapsulation parameters/installation method: Through Hole
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2SK1152L-E
|
Renesas Electronics | 功能相似 | DPAK |
硅N沟道MOS FET Silicon N Channel MOS FET
|
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