Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: QFP
External dimensions/height: 1.4 mm
External dimensions/packaging: QFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V67603S166PFG
|
Integrated Device Technology | 完全替代 | TQFP-100 |
SRAM Chip Sync Single 3.3V 9M-bit 256K x 36 3.5ns 100Pin TQFP Tray
|
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