Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74HCT164M
|
TI | 功能相似 | SOIC-14 |
TEXAS INSTRUMENTS CD74HCT164M 移位寄存器, HCT系列, 串行至并行, 1元件, SOIC, 14 引脚, 4.5 V, 5.5 V
|
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