Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CAT28LV64H1325
|
Catalyst | 功能相似 | TSOP1 |
IC EEPROM 64Kbit 250NS 28TSOP
|
||
CAT28LV64H1325
|
ON Semiconductor | 功能相似 | TSOP-28 |
IC EEPROM 64Kbit 250NS 28TSOP
|
||
CAT28LV64H13I-25T
|
Catalyst | 功能相似 | TSOP |
EEPROM 64Kbit CMOS PARA EEPROM
|
||
|
|
Catalyst | 功能相似 | TSOP1 |
EEPROM Parallel 64Kbit 8K x 8 3.3V 28Pin TSOP Tube
|
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