Package parameters/number of pins: 356
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
RTPXA270C5C416
|
Intel | 功能相似 | BGA-356 |
SOC PXA270 356Pin VFBGA
|
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