Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC1263CS8
|
ADI | 功能相似 | SOIC |
Conv DC-DC 4.75V to 5.5V Step Up Single-Out 12V 0.06A 8-Pin SOIC N
|
||
LTC1263CS8
|
Linear Technology | 功能相似 | SO |
Conv DC-DC 4.75V to 5.5V Step Up Single-Out 12V 0.06A 8-Pin SOIC N
|
||
|
|
ADI | 功能相似 | SOP |
IC DC-DC CONV FLASHMEM 12V 8SOIC
|
||
LTC1263IS8#TRPBF
|
Linear Technology | 功能相似 | SOIC-8 |
IC DC-DC CONV FLASHMEM 12V 8SOIC
|
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