Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M93C46-MN6TP
|
ST Microelectronics | 功能相似 | SOIC-8 |
16千位,千位8 , 4千位,千位2和1千位( 8位或16位宽) MICROWIRE㈢串行EEPROM的访问 16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit (8-bit or 16-bit wide) MICROWIRE㈢ serial access EEPROM
|
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