Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: BBGA-484
External dimensions/packaging: BBGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XA6SLX45-3FGG484I
|
Xilinx | 完全替代 | BBGA-484 |
XA6SLX45 3FGG484I 磨码
|
||
XC6SLX45-2FG484C
|
Xilinx | 完全替代 | BBGA-484 |
XC6SLX45 2FG484C 磨码
|
||
XC6SLX45-3FGG484C
|
Xilinx | 完全替代 | BBGA-484 |
XC6SLX45 3FGG484C 磨码
|
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