Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX75-2CSG484I
|
Xilinx | 完全替代 | CSBGA-484 |
XC6SLX75 2CSG484I 磨码
|
||
XC6SLX75-3CSG484I
|
Xilinx | 完全替代 | CSBGA-484 |
XC6SLX75-3CSG484I 磨码
|
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