Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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General Semiconductor | 功能相似 |
500mW,BZV55 系列,NXP Semiconductors NXP 500mW 表面安装 (SMT) 齐纳二极管,具有较宽的击穿电压范围。 ### 齐纳二极管,NXP Semiconductors
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Philips | 功能相似 | Mini-MELF |
500mW,BZV55 系列,NXP Semiconductors NXP 500mW 表面安装 (SMT) 齐纳二极管,具有较宽的击穿电压范围。 ### 齐纳二极管,NXP Semiconductors
|
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BZV55-C43
|
Philips | 功能相似 | Mini-MELF |
500mW,BZV55 系列,NXP Semiconductors NXP 500mW 表面安装 (SMT) 齐纳二极管,具有较宽的击穿电压范围。 ### 齐纳二极管,NXP Semiconductors
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BZV55-C43
|
Nexperia | 功能相似 | MiniMELF |
500mW,BZV55 系列,NXP Semiconductors NXP 500mW 表面安装 (SMT) 齐纳二极管,具有较宽的击穿电压范围。 ### 齐纳二极管,NXP Semiconductors
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