Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZV55-C22,115
|
NXP | 类似代替 | Mini-MELF |
Nexperia BZV55-C22,115 单路 齐纳二极管, 22V 5% 500 mW, 2引脚 MiniMELF封装
|
||
BZV55-C22,115
|
Nexperia | 类似代替 | SOD-80 |
Nexperia BZV55-C22,115 单路 齐纳二极管, 22V 5% 500 mW, 2引脚 MiniMELF封装
|
||
|
|
LGE | 类似代替 | SOD-80 |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
|
|
EIC | 类似代替 | Mini-MELF |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
BZV55C22
|
DC Components | 类似代替 |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
|||
BZV55C22
|
Vishay Semiconductor | 类似代替 | MELF |
MULTICOMP BZV55C22 单管二极管 齐纳, BZT55C系列, 22 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
HEF4070BT,653
|
NXP | 功能相似 | SOIC-14 |
NXP HEF4070BT,653 异或门, HEF4000系列, 4门, 2输入, 2.4 mA, 4.5V至15.5V, SOIC-14
|
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