Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: Mini-MELF
External dimensions/packaging: Mini-MELF
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
General Semiconductor | 完全替代 |
BZV55-C18 稳压二极管 18V 500mW/0.5W SOD80/LL34-18V marking/标记
|
|||
BZV55-C18,135
|
NXP | 完全替代 | Mini-MELF |
Mini-MELF 17.95V 0.5W(1/2W)
|
||
BZV55C18
|
DC Components | 类似代替 |
单管二极管 齐纳, 18 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
|||
|
|
Microsemi | 类似代替 | DO-213AA |
单管二极管 齐纳, 18 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
BZV55C18
|
Vishay Semiconductor | 类似代替 | MELF |
单管二极管 齐纳, 18 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
||
|
|
YONGYUTAI | 类似代替 | LL34/SOD-80 |
单管二极管 齐纳, 18 V, 500 mW, SOD-80C, 5 %, 2 引脚, 200 °C
|
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