Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SO
External dimensions/packaging: SO
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-5300#300
|
AVAGO Technologies | 功能相似 | DIP-8 |
Optocoupler Logic-Out Pull Up DC-IN 1CH 8Pin CDIP SMD
|
||
HCPL-5301#300
|
AVAGO Technologies | 功能相似 | SO |
Optocoupler Logic-Out Pull Up DC-IN 1CH 8Pin CDIP SMD
|
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