Technical parameters/breakdown voltage: 17.1 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: MELF
External dimensions/packaging: MELF
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZM55C16-TR
|
Vishay Semiconductor | 完全替代 | SMD-2 |
VISHAY BZM55C16-TR 单管二极管 齐纳, AEC-Q101, 16 V, 500 mW, MicroMELF, 5 %, 2 引脚, 175 °C
|
||
BZM55C16-TR
|
VISHAY | 完全替代 | DO-213AB-2 |
VISHAY BZM55C16-TR 单管二极管 齐纳, AEC-Q101, 16 V, 500 mW, MicroMELF, 5 %, 2 引脚, 175 °C
|
||
BZX384-C16
|
Micro Commercial Components | 功能相似 |
Zener Diode, 16V V(Z), 5.56%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2
|
|||
BZX384C16
|
Micro Commercial Components | 功能相似 |
Zener Diode, 16V V(Z), 5.56%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2
|
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